分子筛粉化流失的原因分析及处理

某甲烷深冷分离制天然气装置因分子筛净化设备的分子筛粉化流失而停运。从工艺参数的控制和分子筛吸附器结构的优化两方面采取措施后,整套装置稳定运行。介绍故障现象和原因分析过程,阐述处理措施及其效果。     

某炭浸提金厂技术改造及生产实践

针对内蒙古某炭浸提金厂现场生产存在的问题,采取有效措施对其进行了技术改造。通过对旋流器组矿浆分配器结构、滚筒除屑筛代替直线振动除屑筛、电解解吸液加热器连接方式、压滤机油缸端主梁支架接地端安装活动滚轮等技术改造,解决了该炭浸厂日常生产存在的技术难题,减少了设备故障,获得了一定的经济效益和较为理想的效果。     

塔北地区奥陶系碳酸盐岩缝洞充填方解石的阴极发光特征及对成岩环境的指示意义

对碳酸盐矿物和结构组分进行阴极发光分析可以直观、快捷地研究碳酸盐岩储层的成岩环境和成因。基于塔北地区奥陶系碳酸盐岩缝洞充填方解石阴极发光特征分析,结合Mn2+和Fe2+含量及流体包裹体均一温度,深入研究其对成岩环境的指示作用。结果表明:Mn2+和Fe2+含量及发光特征可大致反映成岩环境的氧化还原条件,明亮发光(Mn2+含量高)表明成岩环境为还原条件,也可能是与不发光胶结作用相关的氧化水停滞有关;昏暗—不发光表明成岩环境为氧化条件,是Mn2+趋向于被氧化为高价态而不易置换Ca2+进入晶格所致;不同产状的缝洞充填方解石发光性、Mn2+和Fe2+含量及两者比值各异,指示不同的成岩环境及充填期次,反映研究区缝洞形成及充填的复杂性和多期性。     

聚酰亚胺固体润滑涂层研究进展

综述了聚酰亚胺(PI)固体润滑涂层的摩擦学性能,分析了分子结构、填充改性、制备工艺等材料内部因素以及介质环境、温度、载荷和滑动速度、基底材料等外部因素对PI固体润滑涂层摩擦学性能的影响。     

A Self‐Assembled DNA Origami‐Gold Nanorod Complex for Cancer Theranostics

A self‐assembled DNA origami (DO)‐gold nanorod (GNR) complex, which is a dual‐functional nanotheranostics constructed by decorating GNRs onto the surface of DNA origami, is demonstrated. After 24 h incubation of two structured DO‐GNR complexes with human MCF7 breast cancer cells, significant enhancement of cell uptake is achieved compared to bare GNRs by two‐photon luminescence imaging. Particularly, the triangle shaped DO‐GNR complex exhibits optimal cellular accumulation. Compared to GNRs, improved photothermolysis against tumor cells is accomplished for the triangle DO‐GNR complex by two‐photon laser or NIR laser irradiation. Moreover, the DO‐GNR complex exhibits enhanced antitumor efficacy compared with bare GNRs in nude mice bearing breast tumor xenografts. The results demonstrate that the DO‐GNR complex can achieve optimal two‐photon cell imaging and photothermal effect, suggesting a promising candidate for cancer diagnosis and therapy both in vitro and in vivo.     

Effect of Li on Safety of Cu Components for EAST

Cu–Li–Cu multilayers were deposited on Si substrate by alternately using magnetron sputtering and resistance evaporation. Scanning Electron Microscope (SEM) and Rutherford Backscattering Spectrometry (RBS) were utilized to study the interaction and diffusion between Cu and Li after 8 h heat treatments at 100, 280, and 480 °C. The RBS results reveal that Li can diffuse into Cu when the temperature rises to 480 °C. As a supplementary experiment on Cu corrosion by Li at lower temperature, bulk Li and Cu were annealed at 240, 320 and 400 °C for 8 h separately in a high-temperature furnace after sealing in quartz ampoules. Morphology images show that Li corrodes grain boundaries of Cu preferentially when the temperature is higher than the melting point of Li, and the corrosion rates are 0.7875, 0.925 and 3.3275 mg/h, respectively. The results are helpful for understanding the Cu corrosion and protecting the Cu components in EAST.     

Predicting the Thermal Conductivity of AlSi/Polyester Abradable Coatings: Effects of the Numerical Method

The final target of this study is to achieve a better understanding of the behavior of thermally sprayed abradable seals such as AlSi/polyester composites. These coatings are used as seals between the static and the rotating parts in aero-engines. The machinability of the composite coatings during the friction of the blades depends on their mechanical and thermal effective properties. In order to predict these properties from micrographs, numerical studies were performed with different software packages such as OOF developed by NIST and TS2C developed at the UTBM. In 2008, differences were reported concerning predictions of effective thermal conductivities obtained with the two codes. In this article, a particular attention was paid to the mathematical formulation of the problem. In particular, results obtained with a finite difference method using a cell-centered approach or a nodal formulation allow explaining the discrepancies previously noticed. A comparison of the predictions of the computed effective thermal conductivities is thus proposed. This study is part of the NEWAC project, funded by the European Commission within the 6th RTD Framework programm (FP6).